This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Qorvo US, Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yinbao Yang and Microelectronics Packaging Innovation.
Introduction
Yinbao Yang is an inventor based in Allen, Texas, and works at Qorvo US, Inc. His patent work addresses reliability in microelectronics packaging, with a focus on reducing delamination and cracking at solder joints.
Latest Patents
Yang is associated with 1 patent: “Delamination/cracking improvement at solder joints in microelectronics package.” The invention describes a microelectronics package and a process for making it, designed to reduce delamination and cracking around solder joints.
The package includes a carrier, a solder joint region, a top intermetallic layer, and a device die. The die’s backside metal layer is made of gold and is at least 0.5 μm thick. The top intermetallic layer comprises gold-nickel-tin or gold-platinum-tin, while the solder joint region contains an Au-rich gold-tin and gold-tin eutectic mixture.
Career Highlights
Yang’s disclosed invention focuses on materials and layer structures that can improve the durability of solder-joint interfaces in microelectronics packages. This work is relevant to package reliability, where cracking and delamination can affect device performance and service life.
Collaborations
Yang’s listed coworkers include Xiaokang Huang and Kenneth Frazee. His patent is associated with Qorvo US, Inc.
Conclusion
Yinbao Yang’s patent describes a materials-based approach to reducing solder-joint delamination and cracking, contributing to more reliable microelectronics packaging.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile