Tucheng, Taiwan

Yih-Jong Hsieh

This inventor holds 2 USPTO granted patents. Top assignees: Foxconn Technology Co., Ltd., Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.. Active years: 2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yih-Jong Hsieh. Retrieved from https://idiyas.com/inventor/yih-jong-hsieh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 6(Granted Patents)


Location History:

  • Tu-Cheng, TW (2007)
  • Tu-Cheng, CN (2007)

Company Filing History:


Years Active: 2007

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Yih-Jong Hsieh: Innovator in Heat Dissipation Technology

Introduction

Yih-Jong Hsieh is a notable inventor based in Tu-Cheng, Taiwan. He has made significant contributions to the field of heat dissipation technology, holding a total of 2 patents. His innovative designs focus on improving the efficiency of electronic components by effectively managing heat.

Latest Patents

Hsieh's latest patents include a heat dissipating device for electronic components and a locking device for heat sinks. The heat dissipating device is designed to be sandwiched between a motherboard and a chassis, facilitating the transfer of heat from the motherboard to the chassis. It features a body that contacts the bottom side of the motherboard, with multiple wings extending from it. Each wing has a connecting section and a contacting section, ensuring effective heat transfer from heat-generating electronic components mounted on the motherboard.

The locking device for heat sinks is another innovative creation by Hsieh. It is designed to securely mount a heat sink to a heat-generating component surrounded by a retention module. This device includes a first locking member that secures one side of the heat sink to the retention module, while a second locking member operates to lock the heat sink in place. The operating member pivots to drive the second locking member from a released position to a locked position, ensuring stability and efficiency in heat management.

Career Highlights

Throughout his career, Yih-Jong Hsieh has worked with prominent companies such as Foxconn Technology Co., Ltd. and Fu Zhun Precision Industry (Shenzhen) Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in electronic component design.

Collaborations

Hsieh has collaborated with notable coworkers, including Fang-Xiang Yu and Shu-Ho Lin. Their combined expertise has fostered innovation in the field of heat dissipation technology.

Conclusion

Yih-Jong Hsieh is a distinguished inventor whose work in heat dissipation technology has made a significant impact on the efficiency of electronic components. His patents reflect a commitment to innovation and excellence in engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…