This inventor holds 1 USPTO granted patent. Top assignee: Xintec Corporation. Active years: 2017.
Company Filing History:
Years Active: 2017
Title: Yi-Ying Kuo: Innovator in Chip Packaging Technology
Introduction
Yi-Ying Kuo is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of chip packaging technology. His innovative approach has led to the development of a unique patent that enhances the functionality and efficiency of chip packages.
Latest Patents
Yi-Ying Kuo holds a patent for a "Chip package having a trench exposed protruding conductive pad." This invention includes a chip, an insulating layer, a flowing insulating material layer, and a conductive layer. The chip features a conductive pad, a side surface, a first surface, and a second surface opposite to the first surface. The side surface is positioned between the first and second surfaces, with the conductive pad located below the first surface and protruding from the side surface. The insulating layer covers the second surface and the side surface, while the flowing insulating material layer is situated below the insulating layer. This layer contains a trench that exposes the conductive pad protruding from the side surface. The conductive layer is placed beneath the flowing insulating material layer and extends into the trench to make contact with the conductive pad.
Career Highlights
Yi-Ying Kuo is currently employed at Xintec Corporation, where he continues to innovate in the field of semiconductor technology. His work has been instrumental in advancing chip packaging solutions that meet the demands of modern electronics.
Collaborations
Throughout his career, Yi-Ying Kuo has collaborated with talented individuals such as Ming-Chieh Huang and Hsi-Chien Lin. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Yi-Ying Kuo is a prominent figure in the realm of chip packaging technology, with a patent that showcases his innovative spirit. His contributions to the industry are significant, and his work at Xintec Corporation continues to influence the future of semiconductor technology.