Yi-Ting Wu

Title: Yi-Ting Wu: Innovator in Semiconductor Packaging

Introduction

Yi-Ting Wu is a notable inventor based in Kaohsiung, Taiwan. She has made significant contributions to the field of semiconductor technology. Her innovative work has led to the development of a unique semiconductor package that enhances communication between chips.

Latest Patents

Yi-Ting Wu holds a patent for a semiconductor package and method for making the same. This invention includes a silicon substrate unit, a bridge chip, and at least one active chip. The silicon substrate unit features a cavity and multiple vias. The bridge chip is attached to the cavity and contains several non-contact pads. The active chip is positioned above the bridge chip and also has non-contact pads along with conducting elements. The conducting elements of the active chip connect to the vias of the silicon substrate unit, while the non-contact pads of the active chip are designed to face, but not physically contact, the non-contact pads of the bridge chip. This design facilitates proximity communication between the active chip and the bridge chip.

Career Highlights

Yi-Ting Wu is currently employed at Advanced Semiconductor Engineering, Inc. Her work at this esteemed company has allowed her to further her research and development in semiconductor packaging technologies.

Collaborations

One of her notable coworkers is Chao-Fu Weng, who has collaborated with her on various projects within the semiconductor field.

Conclusion

Yi-Ting Wu's contributions to semiconductor packaging demonstrate her innovative spirit and commitment to advancing technology. Her patent reflects her expertise and the potential impact of her work in the industry.