Yi-Rong Ho

Title: Yi-Rong Ho: Innovator in Chip Packaging Technology

Introduction

Yi-Rong Ho is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of chip packaging technology. His innovative approach has led to the development of a unique chip package that enhances the functionality and efficiency of electronic devices.

Latest Patents

Yi-Rong Ho holds a patent for a chip package and manufacturing method. This invention includes a chip that features a light emitter and a light receiver located on its top surface. The design incorporates a sidewall structure with a first and second light-shielding layer, which surrounds the light emitter and receiver. The sidewall structure also has two aperture areas that allow for optimal light transmission. This innovative packaging solution is crucial for improving the performance of electronic components.

Career Highlights

Yi-Rong Ho is currently employed at Xintec Corporation, where he continues to push the boundaries of chip packaging technology. His work has been instrumental in advancing the capabilities of modern electronic devices. With a focus on innovation, he has dedicated his career to developing solutions that meet the evolving needs of the industry.

Collaborations

Throughout his career, Yi-Rong Ho has collaborated with talented individuals such as Yen-Shih Ho and Po-Han Lee. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Yi-Rong Ho is a key figure in the field of chip packaging, with a patent that showcases his innovative spirit. His contributions at Xintec Corporation and collaborations with fellow inventors highlight his commitment to advancing technology. His work continues to impact the electronics industry positively.