Dresden, Germany

Yi-Ming Chiu

This inventor holds 1 USPTO granted patent. Top assignee: Qimonda Ag. Active years: 2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yi-Ming Chiu. Retrieved from https://idiyas.com/inventor/yi-ming-chiu-4sqvu8c8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: Yi-Ming Chiu: Innovator in Semiconductor Technology

Introduction

Yi-Ming Chiu is a notable inventor based in Dresden, Germany. He has made significant contributions to the field of semiconductor technology, particularly through his innovative methods in double patterning.

Latest Patents

Yi-Ming Chiu holds a patent for a "Method of double patterning, method of processing a plurality of semiconductor wafers and semiconductor device." This patent outlines a method that includes forming a first photosensitive layer, exposing it using a first reticle, and developing it to create a first image pattern. The process continues with the formation and exposure of a second photosensitive layer, ultimately resulting in a second image pattern.

Career Highlights

Chiu is associated with Qimonda AG, a company known for its advancements in semiconductor technology. His work has been instrumental in enhancing the efficiency and effectiveness of semiconductor devices.

Collaborations

Some of his notable coworkers include Christoph Noelscher and Yuan-Hsun Wu, who have also contributed to the field of semiconductor research.

Conclusion

Yi-Ming Chiu's innovative work in semiconductor technology, particularly his patented methods, showcases his expertise and commitment to advancing the industry. His contributions continue to influence the development of semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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