Yi-Liang Peng

Title: Yi-Liang Peng: Innovator in Heat Dissipation Technologies

Introduction

Yi-Liang Peng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit packaging, particularly in heat dissipation technologies. With a total of three patents to his name, his work has been instrumental in enhancing the performance and reliability of electronic devices.

Latest Patents

Yi-Liang Peng's latest patents include a dual-sided heat dissipating structure for integrated circuit packages. This innovative design features a step-shaped first heat dissipating member that adheres to the active side of the chip, along with a dish-shaped perforated second heat dissipating member on the non-active side. This configuration allows for more effective heat dissipation, addressing the challenges posed by heat generated within the chip. Additionally, the step surface of the first heat dissipating member serves as a press mold, facilitating the bonding of inner leads to the chip's bonding pads without requiring additional processes or equipment. His second patent focuses on an enhanced heat dissipating Chip Scale Package (CSP) method and devices. This method involves preparing a heat dissipating base with a recess and adhering a chip with an integrated circuit layout within it. The resulting package is compact and boasts improved heat dissipation properties, meeting CSP requirements with a size ratio lower than 1.2.

Career Highlights

Throughout his career, Yi-Liang Peng has worked with various companies, including First International Computer, Inc. His experience in the industry has allowed him to develop and refine his innovative ideas, contributing to advancements in electronic packaging technologies.

Collaborations

Yi-Liang has collaborated with notable colleagues such as Tsung-Chieh Chen and Ken-Hsiung Hsu. Their combined expertise has fostered a collaborative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Yi-Liang Peng's contributions to heat dissipation technologies in integrated circuit packaging have made a significant impact on the electronics industry. His innovative patents and collaborative efforts highlight his dedication to advancing technology and improving device performance.