First International Computer, Inc.

Other

Yi-Liang Peng

Tsung-Chieh Chen

Ken-Hsiung Hsu

Cheng-Chieh Hsu

A dual-sided heat dissipating structure for BGA package includes a step-shaped first heat dissipating member adhering to an active side of the chip and a dish-shaped perforated second heat dissipating member adhering to a non-active side of the chip so that heat generated in the chip may be dissipated more effectively. The step surface first heat dissipating member may also serve as a press mold to enable bonding of inner leads of the substrate to the bonding pads of the chip be done along with adhering of the first heat dissipating member to the chip at same process in the mean time without additional process or equipment. The perforated second heat dissipating member enables moisture escaping from the package to avoid pop corn effect resulting from IR Reflow test. The package may be made at a thin thickness and low cost.

Dual-sided heat dissipating structure for integrated circuit package

An enhanced heat dissipating Chip Scale Package (CSP) method and devices include preparing a heat dissipating base with a recess surrounded by a guarding wall. A chip with an integrated circuit (IC) layout is adhered the heat dissipating base in the recess. A substrate with a metallic circuit layer that is smaller size than the chip is then adhered to the chip. Then coupling the metallic circuit layer with the IC layout. A non-conductive resin is then filled in the recess within the guarding wall and covers the coupling portion. The resulting package device produced by means of BGA package process is small size and has enhanced heat dissipating property. The Package size/chip size ratio may be lower than 1.2 to meet the CSP requirements.

Enhanced heat dissipating chip scale package method and devices

A thin enhanced TAB BGA package includes an IC chip, a substrate having a center opening and one side laid with a metallic circuitry which has a plurality of inner leads extending to the center opening, a plurality of metallic solder balls attached to the substrate at one side and coupling with the metallic circuitry, and a heat dissipating member adhering partly to the a side of the chip and partly to the substrate for heat dissipating, positioning and supporting the IC chip and the substrate. The IC chip has a another side exposed to ambience to add heat dissipating effect. The heat dissipating member has about same thickness as the substrate. Hence the ball grid array package may be made of a small size and thin thickness. The adhering of heat dissipating member to the chip and substrate may be done at the same process of bonding the inner leads to the IC chip. Thus the thin enhanced TAB BGA package of this invention may be produced at low cost without additional equipment or process.

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Hsinchu, Taiwan

Yi-Liang Peng