The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2000
Filed:
Jun. 14, 1999
Tsung-Chieh Chen, Taipei, TW;
Yi-Liang Peng, Hsinchu, TW;
First International Computer Inc., Taipei, TW;
Abstract
An enhanced heat dissipating Chip Scale Package (CSP) method and devices include preparing a heat dissipating base with a recess surrounded by a guarding wall. A chip with an integrated circuit (IC) layout is adhered the heat dissipating base in the recess. A substrate with a metallic circuit layer that is smaller size than the chip is then adhered to the chip. Then coupling the metallic circuit layer with the IC layout. A non-conductive resin is then filled in the recess within the guarding wall and covers the coupling portion. The resulting package device produced by means of BGA package process is small size and has enhanced heat dissipating property. The Package size/chip size ratio may be lower than 1.2 to meet the CSP requirements.