Shanghai, China

Yi Lei Zhu

This inventor holds 1 USPTO granted patent. Top assignee: 3M Innovative Properties Company. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yi Lei Zhu. Retrieved from https://idiyas.com/inventor/yi-lei-zhu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Yi Lei Zhu - Innovator in Adhesive Technology

Introduction

Yi Lei Zhu is a notable inventor based in Shanghai, China. He has made significant contributions to the field of adhesive technology, particularly in the development of specialized adhesive tapes. His innovative approach addresses critical challenges in semiconductor device packaging.

Latest Patents

Yi Lei Zhu holds a patent for an adhesive tape that includes a base film with a coefficient of thermal expansion ranging from 4.5 to 15 ppm/° C. The adhesive layer consists of polyether ether ketone, which has a crystallinity equal to or less than 10% and an elastic modulus between 10 and 100 MPa at temperatures of 150-300° C. This invention effectively mitigates issues such as chip tilt, packaging material flash, contamination from adhesive residue, and lead frame warpage during the back-end packaging of semiconductor devices. He has 1 patent to his name.

Career Highlights

Yi Lei Zhu is currently employed at 3M Innovative Properties Company, where he continues to develop cutting-edge adhesive solutions. His work has been instrumental in enhancing the reliability and performance of semiconductor packaging.

Collaborations

He collaborates with talented coworkers, including Yunshu Zhang and Chao Yang, who contribute to the innovative environment at 3M.

Conclusion

Yi Lei Zhu's contributions to adhesive technology exemplify the importance of innovation in the semiconductor industry. His patented adhesive tape addresses critical challenges, showcasing his expertise and commitment to advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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