The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Mar. 29, 2022
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Yunshu Zhang, Shanghai, CN;

Yi Lei Zhu, Shanghai, CN;

Chao Yang, Shanghai, CN;

Xue-Hua Chen, Shanghai, CN;

Lei Dong, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/25 (2018.01); C09J 7/38 (2018.01);
U.S. Cl.
CPC ...
C09J 7/25 (2018.01); C09J 7/38 (2018.01); C09J 2203/326 (2013.01); C09J 2301/302 (2020.08); C09J 2433/00 (2013.01); C09J 2475/00 (2013.01); C09J 2479/086 (2013.01); Y10T 428/28 (2015.01); Y10T 428/2843 (2015.01); Y10T 428/2852 (2015.01);
Abstract

Provided in the present invention is an adhesive tape, including: a base film, having a coefficient of thermal expansion within a range of 4.5 to 15 ppm/° C.; and an adhesive layer, including polyether ether ketone having a crystallinity equal to or less than 10% and an elastic modulus between 10 and 100 MPa at 150-300° C. The adhesive tape according to the technical solution of the present invention can effectively avoid problems such as chip tilt, packaging material flash, contamination caused by an adhesive residue, lead frame warpage, and the like during back-end packaging of a semiconductor device.


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