This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: United Microelectronics Corp.. Active years: 2023.
Company Filing History:
Years Active: 2023
Title: Yi-Hui Tseng: Innovator in Wafer Edge Detection Technology
Introduction
Yi-Hui Tseng is a notable inventor based in Taoyuan, Taiwan. She has made significant contributions to the field of semiconductor technology, particularly in the area of wafer edge detection. Her innovative work has led to the development of a patented method that enhances the quality control processes in semiconductor manufacturing.
Latest Patents
Yi-Hui Tseng holds a patent for an "Automatic detection method and automatic detection system for detecting crack on wafer edges." This invention provides a systematic approach to identifying cracks on wafer edges, which is crucial for maintaining the integrity of semiconductor devices. The method involves obtaining several wafer images, integrating them to create a template image, and comparing each wafer image with the template to produce differential images. These images are then binarized and de-noised to detect any edge cracks effectively.
Career Highlights
Yi-Hui Tseng is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. Her work at this organization has allowed her to apply her innovative ideas in a practical setting, contributing to advancements in wafer inspection technologies.
Collaborations
Throughout her career, Yi-Hui has collaborated with talented individuals such as Chia-Feng Hsiao and Chung-Hsuan Wu. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Yi-Hui Tseng's contributions to wafer edge detection technology exemplify her commitment to innovation in the semiconductor industry. Her patented methods not only enhance manufacturing processes but also ensure the reliability of semiconductor devices.