Yi-Hua Ho

Title: Yi-Hua Ho: Innovator in Integrated Circuit Technology

Introduction

Yi-Hua Ho is a prominent inventor based in Kaohsiung, Taiwan. She has made significant contributions to the field of integrated circuits, particularly through her innovative patent that enhances modular packing technology. Her work is recognized for its potential to improve the efficiency and versatility of electronic devices.

Latest Patents

Yi-Hua Ho holds a patent titled "Method and Integrated Circuits of Module Packing." This invention provides a modular packing integrated circuit card and its manufacturing method. The modular packing integrated circuit card comprises a shell, a composite chip unit, and a switch card with a specific interface format. The switch card has a predetermined space for locating the composite chip unit, enabling the predetermined pins of the composite chip unit to connect with the predetermined lines of the switch card. Additionally, the switch card includes an interface device for a specific interface format to connect with the predetermined lines. This design allows the composite chip unit to be manufactured in different interface formats by using various switch cards, facilitating easier exchanges between different interface formats.

Career Highlights

Yi-Hua Ho is currently employed at C-One Technology Corporation, where she continues to develop innovative solutions in the field of integrated circuits. Her work at the company has positioned her as a key player in advancing technology that meets the demands of modern electronics.

Collaborations

Some of her notable coworkers include Gordon Yu and Hung-Tse Ho, who contribute to the collaborative environment that fosters innovation at C-One Technology Corporation.

Conclusion

Yi-Hua Ho's contributions to integrated circuit technology exemplify her commitment to innovation and excellence. Her patent not only showcases her inventive spirit but also highlights the importance of modular packing in modern electronics.