The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2007
Filed:
Apr. 22, 2005
Gordon Yu, Taipei, TW;
Hung-tse Ho, Taipei, TW;
Yi-hua Ho, Kaohsiung, TW;
Ming-che Chang, Tainan, TW;
Gordon Yu, Taipei, TW;
Hung-Tse Ho, Taipei, TW;
Yi-Hua Ho, Kaohsiung, TW;
Ming-Che Chang, Tainan, TW;
C-One Technology Corp., Hsin-Chu, TW;
Abstract
The present invention provides a modular packing integrated circuit card and its manufacturing method. The above modular packing integrated circuit card comprises a shell, a composite chip unit, and a switch card with a specific interface format. The switch card has a predetermined space for locating the composite chip unit, and enabling the predetermined pins of the composite chip unit to be connected with the predetermined lines of the switch card. The switch card further includes an interface device for a specific interface format so as to connect with the predetermined lines. Finally, the switch card is fastened in the shell. Consequently, the composite chip unit can be manufactured as different interface formats by using different switch cards, such that different interface formats are easier to be exchanged with each other.