Shanghai, China

Yi Hou

This inventor holds 1 USPTO granted patent. Top assignee: Teradyne (Asia) Pte. Ltd.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yi Hou. Retrieved from https://idiyas.com/inventor/yi-hou-iwcpjtan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Yi Hou

Introduction

Yi Hou is a notable inventor based in Shanghai, China. He has made significant contributions to the field of simulation equipment through his innovative designs. His work focuses on enhancing the performance and efficiency of device testing.

Latest Patents

Yi Hou holds a patent for a device under test simulation equipment. This equipment includes a first circuit board with a field programmable gate array (FPGA), a second circuit board with a processor, and a power distribution board. The design allows the first circuit board to receive power from the power distribution board while simulating the performance of a device under test (DUT). The DUT simulation equipment effectively provides a response signal after receiving a test signal from a tester, showcasing Yi's ingenuity in this area. He has 1 patent to his name.

Career Highlights

Yi Hou is currently employed at Teradyne (Asia) Pte. Ltd., where he continues to develop advanced testing solutions. His role involves collaborating with other engineers and researchers to push the boundaries of technology in simulation equipment.

Collaborations

Some of his coworkers include Min Nie and Siqiang Jia, who work alongside him in the pursuit of innovative solutions in the field.

Conclusion

Yi Hou's contributions to device under test simulation equipment highlight his role as a forward-thinking inventor. His work not only advances technology but also sets a foundation for future innovations in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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