Company Filing History:
Years Active: 2014-2023
Title: Yi-Hang Lin: Innovator in Semiconductor Packaging
Introduction
Yi-Hang Lin is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of nine patents. His innovative work focuses on improving chip package structures and methods for forming them.
Latest Patents
One of Yi-Hang Lin's latest patents is titled "Chip package structure with ring structure and method for forming the same." This patent describes a method for forming a chip package structure that includes disposing a first chip structure and a second chip structure over a wiring substrate. The first chip structure is spaced apart from the second chip structure by a gap. The method also involves placing a ring structure over the wiring substrate, which has a first opening that accommodates both chip structures. The first opening features a first inner wall with a first recess, and the gap extends toward this recess.
Another notable patent is focused on methods of packaging semiconductor devices, including placing semiconductor devices into die caves. This method involves providing a carrier wafer and a plurality of dies, followed by forming a die cave material over the carrier wafer. A plurality of die caves is created in the die cave material, and at least one die is placed within each cave. Subsequently, a plurality of packages is formed over each respective die.
Career Highlights
Yi-Hang Lin is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing packaging technologies that enhance the performance and reliability of semiconductor devices.
Collaborations
Yi-Hang Lin has collaborated with notable colleagues, including Jing-Cheng Lin and Jui-Pin Hung. Their combined expertise contributes to the innovative projects at Taiwan Semiconductor Manufacturing Company Limited.
Conclusion
Yi-Hang Lin's contributions to semiconductor packaging through his patents and collaborative efforts highlight his role as a key innovator in the industry. His work continues to influence advancements in technology and improve the efficiency of semiconductor devices.