This inventor holds 1 USPTO granted patent. Top assignee: Powerchip Semiconductor Corporation. Active years: 2006.
Company Filing History:
Years Active: 2006
Title: Yi-Chung Cheng: Innovator in Semiconductor Technology
Introduction
Yi-Chung Cheng is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent work. His expertise and dedication have positioned him as a valuable asset in the industry.
Latest Patents
Yi-Chung Cheng holds a patent for a "Method of forming barrier layer." This invention involves providing a substrate with at least one conducting layer. A chemical vapor deposition (CVD) process is then performed to form a titanium/titanium nitride (Ti/TiN) barrier layer onto the conducting layer. Following this, an examination procedure is conducted. If any particles are detected in the Ti/TiN barrier layer, a rework procedure is initiated to remove the existing layer and reform a new Ti/TiN barrier layer. This innovative method enhances the reliability and performance of semiconductor devices.
Career Highlights
Yi-Chung Cheng is currently employed at Powerchip Semiconductor Corporation, where he continues to advance semiconductor technology. His work at this leading company has allowed him to apply his inventive skills in a practical setting, contributing to the development of cutting-edge semiconductor solutions.
Collaborations
Yi-Chung Cheng collaborates with fellow inventor Ching-Hua Chen, further enhancing the innovative capabilities within their field. Their partnership exemplifies the importance of teamwork in driving technological advancements.
Conclusion
Yi-Chung Cheng is a notable inventor whose contributions to semiconductor technology are marked by his innovative patent for a method of forming barrier layers. His work at Powerchip Semiconductor Corporation and collaborations with other inventors highlight his commitment to advancing the industry.