Fremont, CA, United States of America

Yi-Chun Liu

This inventor holds 6 USPTO granted patents. Top assignee: Headway Technologies, Incorporated. Active years: 2001-2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yi-Chun Liu. Retrieved from https://idiyas.com/inventor/yi-chun-liu-o3oje1co

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 33.3

Average Co-Inventor Count = 3.6

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2001-2006

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6 patents (USPTO):Explore Patents

Title: Innovations of Yi-Chun Liu

Introduction

Yi-Chun Liu is a notable inventor based in Fremont, CA, who has made significant contributions to the field of technology. With a total of 6 patents to his name, Liu has focused on advancements in manufacturing processes that enhance the performance and reliability of electronic components.

Latest Patents

One of Liu's latest patents is a process for manufacturing coil layers using a novel combination of photoexposure and thermal curing. This innovative method achieves shape control of a photoresist material, allowing for the formation of at least two layers of electrical coils and their supportive resistive layers for a magnetic write head. The design features an ultra-short yoke, ensuring that the second and any additional coil layers are formed on flat resistive surfaces. This eliminates problems associated with inter- and intra-layer shorting and shorting between the coil and yoke. The resistive layers are created with flat surfaces and desired apex angles through a two-step photoresist scheme, which involves photoexposing and developing a layer of photoresist, followed by a second photoexposure to cure a surface region that remains flat during a final low-temperature curing process.

Another significant patent involves a masking frame plating method for forming a masking frame plated layer. In this method, a substrate is first provided, and a masking frame is formed over it. This masking frame is designed to mask frame plating a plated layer within the frame itself. The unique design includes an overhang of the upper portion of the masking frame, which is spaced further from the substrate compared to the lower portion. This method is particularly useful for forming masking frame plated magnetic pole tip stack layers with enhanced planarity dimensional control within magnetic transducer elements.

Career Highlights

Yi-Chun Liu is currently employed at Headway Technologies, Incorporated, where he continues to innovate and develop new technologies. His work has significantly impacted the field of magnetic transducers and electronic components.

Collaborations

Liu has collaborated with several talented individuals, including Jei-Wei Chang and Kochan Ju, who have contributed to his projects and innovations.

Conclusion

Yi-Chun Liu's contributions to technology through his patents and innovative methods have established him as a prominent figure in his field. His work continues to influence advancements in electronic manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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