The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6387599 B1

PDF
Full Text
Expired
Date of Patent:
May. 14, 2002

Filed:

Jan. 08, 2001
Applicant:
Inventors:

Xuehua Wu, Union City, CA (US);

Yi-Chun Liu, Fremont, CA (US);

Jei-Wei Chang, Cupertino, CA (US);

Kochan Ju, Fremont, CA (US);

Assignee:

Headway Technologies, Inc., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/30 ;
U.S. Cl.
CPC ...
G03F 7/30 ;
Abstract

The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including development, proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.


Find Patent Forward Citations

Wu, Xuehua. (2002). Corrosion inhibitor of nicu for high performance writers (U.S. Patent No. 6387599). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6387599

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