This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Siliconware Precision Industries, Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yi-Chieh Wang: Electronic Packaging Innovation
Introduction
Yi-Chieh Wang is an inventor associated with Taichung, Taiwan, and Siliconware Precision Industries, Ltd. His patent work addresses electronic packaging and the design of carrier structures.
Latest Patents
Wang is credited with 1 patent, titled “Electronic Package and Fabricating Method Thereof.” The invention places first and second electronic elements on a carrier structure and electrically connects them with a wire. By using the wire in place of some circuit-layer connections, the design can support signal transmission while reducing the number of circuit layers. This approach is intended to shorten manufacturing steps and time and lower production costs.
Career Highlights
Wang’s listed patent reflects work on improving the structure and fabrication of electronic packages. His professional association is with Siliconware Precision Industries, Ltd.
Collaborations
Huan-Shiang Li is identified as Wang’s coworker. The available information does not specify their roles or describe a particular joint project.
Conclusion
Yi-Chieh Wang’s patent focuses on simplifying electronic-package carrier structures through wire connections, with the goal of reducing manufacturing complexity, time, and cost.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile