Yeong-Tsyr Hwang

Title: Yeong-Tsyr Hwang: Innovator in Epoxy Resin Technology

Introduction

Yeong-Tsyr Hwang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of epoxy resin technology, holding 2 patents that showcase his innovative approach to adhesive formulations.

Latest Patents

One of his latest patents involves an epoxy resin composition designed for use as an adhesive in flexible printed circuit boards. This invention provides a unique formulation that includes prepolymerizing epoxy resin and functionalized rubber with filler. The resulting adhesive exhibits excellent migration inhibition, moisture adsorption resistance, and superior properties such as peeling strength, heat resistance, solvent resistance, chemical resistance, flexibility, and electrical properties. The preparation method involves pre-polymerizing the epoxy resin, COOH-containing rubber, filler, and a primary catalyst in a solvent, followed by curing the prepolymer with a curing agent and catalyst. The adhesive is then coated on a plastic film, dried, laminated with copper foil, and cured at elevated temperatures to form a substrate.

Career Highlights

Throughout his career, Yeong-Tsyr Hwang has worked with prominent organizations, including the Industrial Technology Research Institute and Mektec Corporation. His work in these institutions has allowed him to develop and refine his innovative adhesive technologies.

Collaborations

He has collaborated with talented individuals such as Tseng-Young Tseng and Hsiao-Chian Li, contributing to advancements in adhesive technology and epoxy resin applications.

Conclusion

Yeong-Tsyr Hwang's contributions to epoxy resin technology and adhesive formulations highlight his role as an influential inventor in the field. His innovative approaches continue to impact the industry positively.