The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 1998

Filed:

Jun. 23, 1997
Applicant:
Inventors:

Tseng-Young Tseng, Taoyuan Hsien, TW;

Yeong-Tsyr Hwang, Hsinchu, TW;

Hsiao-Chian Li, Hsinchu, TW;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K / ; C08L / ; C08L / ;
U.S. Cl.
CPC ...
523428 ; 523434 ; 523457 ; 523459 ; 523467 ; 525527 ; 525529 ; 525530 ; 525531 ;
Abstract

An adhesive for a flexible printed circuit board and the method of preparing the same where the adhesive displays excellent migration inhibition, moisture adsorption resistance, and superior peeling strength, heat resistance, solvent resistance, chemical resistance, flexibility, and electrical properties. The adhesive is prepared by pre-polymerizing an epoxy resin, a COOH-containing rubber, a filler, and a primary catalyst in a solvent using a tertiary amine as a primary catalyst to form a prepolymer, followed by curing the prepolymer using a curing agent and a curing catalyst. The adhesive is coated on a plastic film, dried and laminated with a copper foil and then cured at an elevated temperature to form a substrate.


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