Tseng-Young Tseng

Title: Tseng-Young Tseng: Inventor of an Advanced Flexible Circuit Board Adhesive

Introduction

Tseng-Young Tseng is an inventor associated with Taoyuan, Taiwan. His work includes an adhesive technology designed for flexible printed circuit boards, and he has been associated with the Industrial Technology Research Institute and Mektec Corporation.

Latest Patents

The available information identifies one patent for Tseng-Young Tseng: Prepolymerizing Epoxy Resin, Functionalized Rubber with Filler to Form an Adhesive for a Flexible Printed Circuit Board and the Method of Preparing the Same. The invention describes an adhesive intended to inhibit migration and resist moisture adsorption while providing peeling strength, heat and solvent resistance, chemical resistance, flexibility, and electrical performance.

The disclosed preparation method pre-polymerizes epoxy resin, carboxyl-containing rubber, filler, and a primary catalyst in a solvent to form a prepolymer. A curing agent and curing catalyst are then used to cure the prepolymer. The adhesive is coated onto a plastic film, dried, laminated with copper foil, and cured at elevated temperature to form a substrate.

Career Highlights

Tseng’s listed professional affiliations include the Industrial Technology Research Institute and Mektec Corporation. His patent work addresses materials and manufacturing steps relevant to flexible printed circuit board substrates.

Collaborations

Tseng’s listed coworkers include Yeong-Tsyr Hwang and Hsiao-Chian Li. Their names are associated with his professional and patent-related work.

Conclusion

Tseng-Young Tseng’s identified patent focuses on a flexible circuit board adhesive engineered for durability and electrical performance, reflecting his contributions to materials innovation.