Yeong Kwon Ko

Title: Yeong Kwon Ko: Innovator in Semiconductor Technology

Introduction

Yeong Kwon Ko is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative semiconductor device packaging and manufacturing methods.

Latest Patents

One of his latest patents involves a semiconductor device that comprises a first semiconductor chip with a first chip substrate and a first through via penetrating the substrate. A second semiconductor chip is disposed on the first chip, which includes a second chip substrate and a second through via. The device features a connecting terminal that electrically connects the two chips, along with an inter-chip molding material that fills the space between them.

Another notable patent is for a semiconductor device package that utilizes light to debond a substrate assembly from a carrier substrate. This method includes accommodating a substrate in a cavity of a light-transmitting carrier substrate and defining a molding portion by pressing the support portion and the edge region of the substrate. This innovative approach enhances the manufacturing process of semiconductor devices.

Career Highlights

Yeong Kwon Ko is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the field.

Collaborations

Throughout his career, Yeong Kwon Ko has collaborated with notable colleagues, including Jun Yeong Heo and Un Byoung Kang. These collaborations have fostered innovation and have been instrumental in the development of new technologies.

Conclusion

Yeong Kwon Ko is a distinguished inventor whose work in semiconductor technology has led to multiple patents and significant advancements in the industry. His contributions continue to shape the future of electronics and semiconductor devices.