The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
Jul. 24, 2017
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Seung Won Park, Suwon-si, KR;
Yeong Kwon Ko, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/46 (2006.01); H01L 29/06 (2006.01); H01L 23/473 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/31 (2013.01); H01L 23/3157 (2013.01); H01L 23/46 (2013.01); H01L 29/06 (2013.01); H01L 23/3121 (2013.01); H01L 23/3128 (2013.01); H01L 23/473 (2013.01); H01L 24/94 (2013.01); H01L 25/0652 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06589 (2013.01);
Abstract
A semiconductor package includes a semiconductor chip in which a side step or a side slope formed toward an inactive surface from an active surface is included and a width of the active surface is smaller than a width of the inactive surface, and an underfill which is disposed on the active surface and positioned at an inner side of the edge of the semiconductor chip.