The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
Aug. 23, 2019
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/568 (2013.01); H01L 21/565 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 2221/68313 (2013.01); H01L 2221/68381 (2013.01);
Abstract
A method for manufacturing a semiconductor device package includes: accommodating a substrate in a cavity in a center of a carrier substrate having the cavity in which a substrate with a semiconductor chip mounted thereon is accommodated in the center, having a support portion in contact with a side wall of the cavity to form an upper surface of the side wall and surrounding the cavity, and formed of a light-transmitting material; defining a molding portion of the substrate by pressing the support portion and an edge region of the substrate; and molding the molding portion, to cover the semiconductor chip.