Company Filing History:
Years Active: 2021-2024
Title: Innovations of Jun Yeong Heo in Semiconductor Technology
Introduction
Jun Yeong Heo is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work primarily focuses on advancements in semiconductor packaging and manufacturing methods.
Latest Patents
One of Jun Yeong Heo's latest patents is a semiconductor package that includes a first semiconductor chip with a first chip substrate and a first through via penetrating the substrate. This innovative design features a second semiconductor chip disposed on the first chip, along with a connecting terminal that electrically connects the two chips. Additionally, the device incorporates an inter-chip molding material that fills the space between the chips and encloses the connecting terminal.
Another significant patent involves a method for manufacturing a semiconductor device package. This method includes accommodating a substrate in a cavity of a carrier substrate, which is designed to support the substrate with a semiconductor chip mounted on it. The process involves defining a molding portion of the substrate and molding it to cover the semiconductor chip, showcasing Jun Yeong Heo's expertise in efficient manufacturing techniques.
Career Highlights
Jun Yeong Heo is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His role at Samsung has allowed him to work on cutting-edge technologies and contribute to the company's innovative semiconductor solutions.
Collaborations
Throughout his career, Jun Yeong Heo has collaborated with talented individuals such as Yeong Kwon Ko and Un Byoung Kang. These collaborations have fostered a creative environment that has led to the development of advanced semiconductor technologies.
Conclusion
Jun Yeong Heo's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his innovative spirit and dedication to advancing the field. His inventions are paving the way for future developments in semiconductor packaging and manufacturing methods.