Yeong-jyh Lin

Title: Yeong-jyh Lin: Innovator in Wafer Bonding Technology

Introduction

Yeong-jyh Lin is a prominent inventor based in Nantou County, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in wafer bonding processes. His innovative approach has led to the development of a patented apparatus that enhances the efficiency and effectiveness of wafer bonding.

Latest Patents

Yeong-jyh Lin holds a patent for an "Apparatus and method for wafer bonding." This invention includes a transfer module and a plasma module. The transfer module is designed to transfer a semiconductor wafer, while the plasma module applies a first type of plasma to perform a reduction operation on the wafer's surface. This process occurs at a specific temperature range, converting metal oxides on the wafer's surface to metal. Additionally, a second type of plasma is applied at room temperature to activate the wafer's surface. This innovative technology is crucial for improving semiconductor manufacturing processes.

Career Highlights

Yeong-jyh Lin is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His work at this esteemed company has allowed him to collaborate with other talented professionals in the field. His contributions have been instrumental in advancing wafer bonding techniques, which are vital for the production of high-performance semiconductor devices.

Collaborations

Yeong-jyh Lin has worked alongside notable colleagues, including Yeur-Luen Tu and Chin-wei Liang. Their collaborative efforts have fostered an environment of innovation and excellence within the semiconductor sector.

Conclusion

Yeong-jyh Lin's contributions to wafer bonding technology exemplify his dedication to advancing semiconductor manufacturing. His patented innovations continue to influence the industry, showcasing the importance of research and development in technology.