Yeo-Hoon Yoon

Title: Yeo-Hoon Yoon: Innovator in Semiconductor Technology

Introduction

Yeo-Hoon Yoon is a prominent inventor based in Yongin-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing semiconductor packages, which are crucial for modern electronic devices.

Latest Patents

Yeo-Hoon Yoon's latest patents include innovative designs for semiconductor packages. One of his patents describes a semiconductor package that features a redistribution substrate, an interconnect substrate, a metal layer on the semiconductor chip, and a mold layer positioned in a gap between the semiconductor chip and the interconnect substrate. This design includes a hole penetrating the interconnect substrate, which consists of base layers and a conductive member extending through these layers. The positioning of the interconnect substrate's top surface is adjustable in relation to the metal layer's top surface. Another patent elaborates on similar features, emphasizing the importance of the redistribution substrate in semiconductor packaging.

Career Highlights

Yeo-Hoon Yoon is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His role involves developing advanced semiconductor technologies that contribute to the company's innovative product lineup. His expertise in semiconductor packaging has positioned him as a key player in the field.

Collaborations

Yeo-Hoon Yoon has collaborated with notable colleagues, including Jichul Kim and Jae Choon Kim. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies in semiconductor design.

Conclusion

Yeo-Hoon Yoon's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his importance in the field. His innovative designs continue to shape the future of electronic devices.