Hsin-Chu, Taiwan

Yeng-Ming Chen


Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Yeng-Ming Chen: Innovator in Semiconductor Technology

Introduction

Yeng-Ming Chen, an accomplished inventor based in Hsin-Chu, Taiwan, has made significant contributions to the field of semiconductor technology. With focused expertise and innovative thinking, he has taken strides in enhancing the manufacturing processes within the industry.

Latest Patents

Yeng-Ming Chen holds a patent titled "Fluxless Bumping Process Using Ions." This patent outlines a groundbreaking method that involves providing a semiconductor device containing a bond pad and an under bump metallurgy overlying that bond pad. The process further involves forming a solder structure that includes an outer layer composed of tin oxide. By producing a plasma from at least one of CF, SF, and H, and exposing the solder structure to this plasma, his innovation allows for effective heating and cooling of the solder structure, ultimately yielding a reliable solder bump on the semiconductor device.

Career Highlights

Currently, Yeng-Ming Chen works at Taiwan Semiconductor Manufacturing Company Limited (TSMC), a leader in the semiconductor manufacturing industry. His dedication to improving semiconductor processes, combined with his technical knowledge, has positioned him as a valuable asset in his field. His efforts in pursuing patents illustrate his commitment to innovation and advancement within technology.

Collaborations

Throughout his career, Yeng-Ming Chen has collaborated with esteemed colleagues, including Hsin-Hui Lee and Chia-Fu Lin. Their synergistic efforts have contributed to the development of innovative solutions in semiconductor manufacturing, further enhancing the efficiency and performance of the industry.

Conclusion

Yeng-Ming Chen continues to pave the way for innovation in semiconductor technologies through his inventive spirit and dedication to research. His contributions, highlighted by his patent on the fluxless bumping process, exemplify the importance of creativity and collaboration in advancing technological frontiers. With ongoing support from his colleagues and his influential position at TSMC, the future looks promising for Yeng-Ming Chen and the innovations he will undoubtedly continue to bring forth.

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