Hsin Chu, Taiwan

Yen-hung Lai

USPTO Granted Patents = 1 

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: Innovator Yen-hung Lai: Pioneering Semiconductor Technologies in Hsin Chu

Introduction: Yen-hung Lai is an accomplished inventor located in Hsin Chu, Taiwan. With a significant contribution to the field of semiconductor manufacturing, Lai holds a patent that highlights his innovative approach to creating poly-spacers, essential components in semiconductor substrates.

Latest Patents: Yen-hung Lai's patent, titled "Method for fabricating poly-spacers," outlines a method that involves several steps to enhance the functionality and efficiency of semiconductor devices. The process includes forming an undoped first polysilicon layer on a semiconductor substrate, performing ion implantations at various angles to introduce impurities effectively, and culminating in the etching of the first and second polysilicon layers to create spacers. This innovative technique is crucial for advancing semiconductor technology.

Career Highlights: Yen-hung Lai is currently employed at TSMC (Taiwan Semiconductor Manufacturing Company), a leading organization in semiconductor manufacturing. His work at TSMC positions him at the forefront of technology development, allowing him to contribute significantly to advancements in semiconductor fabrication processes. His expertise and innovations help drive the company's mission to deliver high-quality semiconductor products.

Collaborations: In his professional journey, Yen-hung Lai collaborates with talented colleagues, including Shiou-han Liaw and Yau-feng Lo. These partnerships foster an environment of innovation and knowledge sharing, enabling the team to tackle complex challenges in semiconductor technology and enhance productivity.

Conclusion: Yen-hung Lai's innovative spirit and dedication to semiconductor technology mark him as a notable figure in the field. His patent for fabricating poly-spacers demonstrates his ability to devise effective solutions that propel the industry forward. With continued collaboration and innovation, Lai and his colleagues are set to make substantial contributions to the evolution of semiconductor manufacturing and technology.

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