Kaohsiung, Taiwan

Yen-Chi Huang

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yen-Chi Huang. Retrieved from https://idiyas.com/inventor/yen-chi-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Yen-Chi Huang: Innovator in Semiconductor Technology

Introduction

Yen-Chi Huang is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique method for creating semiconductor device packages.

Latest Patents

Yen-Chi Huang holds 1 patent for his invention titled "Method of making a semiconductor device package." This patent describes a semiconductor device package that includes a carrier and an encapsulant disposed on the carrier. Notably, at least one portion of the encapsulant is spaced from the carrier by a space, which enhances the functionality and efficiency of the device.

Career Highlights

Yen-Chi Huang is currently employed at Advanced Semiconductor Engineering, Inc. His work at this leading company in semiconductor packaging has allowed him to push the boundaries of technology and innovation in the industry.

Collaborations

Yen-Chi has collaborated with talented coworkers, including Tun-Ching Pi and Jin Han Shih, who contribute to the dynamic environment of innovation at their workplace.

Conclusion

Yen-Chi Huang's contributions to semiconductor technology exemplify the spirit of innovation. His patent and work at Advanced Semiconductor Engineering, Inc. highlight his role as a key player in advancing the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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