Yen-Chi Chen

Title: Innovations of Yen-Chi Chen in Wafer-Level Packaging

Introduction: Yen-Chi Chen is a notable inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative designs and methods. His work focuses on enhancing the efficiency and reliability of wafer-level packages.

Latest Patents: Yen-Chi Chen holds a patent for a "Through silicon via-based oscillator wafer-level-package structure and method for fabricating the same." This invention provides a TSV-based oscillator WLP structure and outlines a method for its fabrication. The method includes several steps: providing a silicon base with an oscillator unit, forming at least one package ring around the oscillator unit, and placing a silicon cap on the package ring to envelop the oscillator unit. This design effectively addresses thermal stress issues commonly found in traditional sandwich package structures. Additionally, the innovative wiring design on the lower surface of the base reduces package size and minimizes the consumption of noble metals. He has 1 patent to his name.

Career Highlights: Yen-Chi Chen is associated with Txc Corporation, where he continues to develop cutting-edge technologies in semiconductor packaging. His expertise and innovative approach have positioned him as a key player in the industry.

Collaborations: Some of his notable coworkers include Chi-Chung Chang and Chih-Hung Chiu, who contribute to the collaborative efforts in advancing their projects.

Conclusion: Yen-Chi Chen's contributions to wafer-level packaging technology demonstrate his commitment to innovation and excellence in the semiconductor field. His work not only enhances product performance but also addresses critical challenges in the industry.