The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2014
Filed:
Jun. 22, 2012
Chi-chung Chang, Tao Yuan County, TW;
Chih-hung Chiu, Tao Yuan County, TW;
Yen-chi Chen, Tao Yuan County, TW;
Kuan-neng Chen, Hsinchu, TW;
Jian-yu Shih, Hsinchu, TW;
Chi-Chung Chang, Tao Yuan County, TW;
Chih-Hung Chiu, Tao Yuan County, TW;
Yen-Chi Chen, Tao Yuan County, TW;
Kuan-Neng Chen, Hsinchu, TW;
Jian-Yu Shih, Hsinchu, TW;
TXC Corporation, Taoyuan County, TW;
Abstract
The present invention provides a TSV-based oscillator WLP structure and a method for fabricating the same. The method of the present invention comprises steps: providing a silicon base having an oscillator unit disposed thereon; forming on the silicon base at least one package ring surrounding the oscillator unit; and disposing a silicon cap on the package ring to envelop the oscillator unit. The present invention adopts a cap and a base, which are made of the same material, to effectively overcome the problem of thermal stress occurring in a conventional sandwich package structure. Further, the present invention elaborately designs the wiring on the lower surface of the base to reduce the package size and decrease consumption of noble metals.