Chi-Chung Chang

Title: Chi-Chung Chang: Innovator in Wafer-Level Packaging Technology

Introduction

Chi-Chung Chang is a notable inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of wafer-level packaging. His innovative approach addresses critical challenges in the industry, showcasing his expertise and dedication to advancing technology.

Latest Patents

Chi-Chung Chang holds a patent for a "Through silicon via-based oscillator wafer-level-package structure and method for fabricating the same." This invention provides a TSV-based oscillator WLP structure and outlines a method for its fabrication. The process involves providing a silicon base with an oscillator unit, forming at least one package ring around the oscillator unit, and placing a silicon cap on the package ring to envelop the oscillator unit. This design effectively mitigates thermal stress issues commonly found in traditional sandwich package structures. Additionally, the innovative wiring design on the lower surface of the base reduces package size and minimizes the consumption of noble metals. He has 1 patent to his name.

Career Highlights

Chi-Chung Chang is currently employed at Txc Corporation, where he continues to develop cutting-edge technologies in semiconductor packaging. His work has positioned him as a key player in the industry, contributing to advancements that enhance the performance and reliability of electronic devices.

Collaborations

Chi-Chung Chang collaborates with talented individuals such as Chih-Hung Chiu and Yen-Chi Chen. Their combined expertise fosters an environment of innovation and creativity, leading to groundbreaking developments in their field.

Conclusion

Chi-Chung Chang's contributions to wafer-level packaging technology exemplify his commitment to innovation and excellence. His patent and ongoing work at Txc Corporation highlight his role as a significant inventor in the semiconductor industry.