Jian-Yu Shih

Title: Innovations of Jian-Yu Shih

Jian-Yu Shih is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of advanced packaging structures. His work focuses on improving the efficiency and reliability of electronic components.

Latest Patents

Jian-Yu Shih holds a patent for a "Through silicon via-based oscillator wafer-level-package structure and method for fabricating the same." This invention provides a TSV-based oscillator WLP structure and a method for its fabrication. The method includes several steps: providing a silicon base with an oscillator unit, forming at least one package ring around the oscillator unit, and placing a silicon cap on the package ring to envelop the oscillator unit. This innovative design effectively addresses thermal stress issues commonly found in traditional sandwich package structures. Additionally, the wiring on the lower surface of the base is meticulously designed to minimize package size and reduce the consumption of noble metals.

Career Highlights

Jian-Yu Shih is associated with Txc Corporation, where he continues to advance his research and development efforts. His work has been instrumental in enhancing the performance of semiconductor devices, making them more efficient and reliable.

Collaborations

Some of his notable coworkers include Chi-Chung Chang and Chih-Hung Chiu. Their collaborative efforts contribute to the innovative environment at Txc Corporation.

Conclusion

Jian-Yu Shih's contributions to semiconductor technology through his innovative patent demonstrate his commitment to advancing the field. His work not only addresses current challenges but also paves the way for future developments in electronic packaging.