This inventor holds 1 USPTO granted patent. Top assignee: Xintec Corporation. Active years: 2025.
Company Filing History:
Years Active: 2025
Title: Yen-Chen Lee: Innovator in Chip Packaging Technology
Introduction
Yen-Chen Lee is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in chip packaging. His innovative approach has led to the development of a unique chip package that enhances the efficiency and functionality of semiconductor devices.
Latest Patents
Yen-Chen Lee holds a patent for a "Chip package and manufacturing method thereof." This invention includes a semiconductor structure and a redistribution layer. The semiconductor structure features a substrate, a first isolation layer, and a lower ground pad. The substrate has a top surface, a bottom surface opposite to the top surface, a through hole that extends through both surfaces, and a sidewall surrounding the through hole. The first isolation layer is positioned on the top surface of the substrate, while the lower ground pad is located within the through hole. The redistribution layer extends from the bottom surface of the substrate to the lower ground pad along the sidewall, covering the entire bottom surface of the substrate and establishing an electrical connection to the lower ground pad. This innovative design is crucial for improving the performance of semiconductor packages.
Career Highlights
Yen-Chen Lee is currently employed at Xintec Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing chip packaging methods, making them more efficient and reliable. His dedication to innovation has positioned him as a key player in the industry.
Collaborations
Yen-Chen Lee collaborates with Chieh Chan, who is also a talented professional in the field. Together, they work on various projects that aim to enhance semiconductor technology and improve manufacturing processes.
Conclusion
Yen-Chen Lee's contributions to chip packaging technology exemplify his commitment to innovation in the semiconductor industry. His patent and ongoing work at Xintec Corporation highlight his role as a leading inventor in this critical field.