This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Innovations by Yee Lun Ong in Device Miniaturization
Introduction
Yee Lun Ong is an accomplished inventor based in Penang, Malaysia. He is known for his contributions to the field of electronic assembly, particularly in the area of device miniaturization. His innovative approach has led to the development of a significant patent that enhances the efficiency and compactness of electronic devices.
Latest Patents
Yee Lun Ong holds a patent titled "Recessed vertical interconnects for device miniaturization." This patent describes an electronic assembly that includes a package substrate with a first surface and an opposing second surface. The assembly features a first interconnect that extends between the two surfaces and a second interconnect arranged adjacent to the first. Notably, the first interconnect comprises a first recessed side wall, which plays a crucial role in optimizing space within electronic devices.
Career Highlights
Yee Lun Ong is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His work at Intel has allowed him to collaborate with some of the brightest minds in the industry, contributing to groundbreaking innovations in electronics.
Collaborations
One of his notable collaborators is Bok Eng Cheah, a talented woman who works alongside him at Intel Corporation. Their partnership exemplifies the collaborative spirit within the tech industry, where diverse perspectives lead to innovative solutions.
Conclusion
Yee Lun
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile