Intel Corporation

Yee Lun Ong

Bok Eng Cheah

Jackson Chung Peng Kong

Teong Guan Yew

The present disclosure relates to an electronic assembly including a package substrate with a first surface and an opposing second surface; a first interconnect disposed in the package substrate and extending between the first and the second surfaces; and a second interconnect disposed in the package substrate and extending between the first and the second surfaces; wherein the first interconnect comprises a first recessed side wall and the second interconnect is arranged adjacent the first recessed side wall.

Growing community of inventors

Penang, Malaysia

Yee Lun Ong