Yee Heong Chua

Title: Innovations of Yee Heong Chua in Semiconductor Technology

Introduction

Yee Heong Chua is a notable inventor based in Singapore, recognized for his contributions to semiconductor technology. With a total of four patents to his name, Chua has made significant advancements in the field, particularly in enhancing the reliability of semiconductor packages.

Latest Patents

Chua's latest patents include a semiconductor package that features a leadframe roughened with a chemical etchant to prevent separation between the leadframe and the molding compound. This innovative design improves adhesion between the leadframe and the molten plastic during encapsulation, thereby reducing the likelihood of package separation when exposed to moisture and temperature fluctuations. In one embodiment, the leadframe, made of copper, is treated with a chemical etchant containing sulfuric acid and hydrogen peroxide. Another patent details the process of fabricating semiconductor packages using leadframes that have undergone a similar roughening process, further emphasizing the importance of this technology in ensuring package integrity.

Career Highlights

Throughout his career, Yee Heong Chua has worked with various companies, including Ns Electronics Bangkok and Utac Thai Limited. His experience in these organizations has contributed to his expertise in semiconductor manufacturing and innovation.

Collaborations

Chua has collaborated with several professionals in the industry, including Saravuth Sirinorakul and Arlene V Layson, who have played a role in his projects and advancements in semiconductor technology.

Conclusion

Yee Heong Chua's work in semiconductor technology showcases his innovative spirit and dedication to improving the reliability of electronic components. His patents reflect a commitment to enhancing product performance and durability in the ever-evolving tech landscape.