The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2006
Filed:
Aug. 08, 2003
Applicants:
Saravuth Sirinorakul, Bangkok, TH;
Somchai Nondhasitthichai, Bangkok, TH;
Sitta Jewjaitham, Bangkok, TH;
Yee Heong Chua, Singapore, SG;
Inventors:
Saravuth Sirinorakul, Bangkok, TH;
Somchai Nondhasitthichai, Bangkok, TH;
Sitta Jewjaitham, Bangkok, TH;
Yee Heong Chua, Singapore, SG;
Assignee:
NS Electronics Bangkok (1993) Ltd., Bangkok, TH;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
Abstract
A series of grooves are etched in a leadframe to be used in fabricating a group of semiconductor packages at locations where the leadframe will later be sawed to separate the semiconductor packages. In variations of the process, the grooves may be wider or narrower than the kerf of the saw cuts and may be formed on the side of the leadframe facing towards or away from the entry of the saw blade.