Yee Beng Daryl Yeow

Title: Innovations of Yee Beng Daryl Yeow

Introduction

Yee Beng Daryl Yeow is a notable inventor based in Melaka, Malaysia. He has made significant contributions to the field of semiconductor technology. With a total of 2 patents, his work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

One of his latest patents is a semiconductor package with a releasable isolation layer protection. This innovative semiconductor device includes a package body that consists of an encapsulant portion and an isolation structure. A semiconductor die is embedded within the package body, and a plurality of leads protrude from the encapsulant body. The encapsulant portion and the isolation structure are both electrically insulating structures. Notably, the isolation structure has a greater thermal conductivity than the encapsulant portion and is thermally coupled to the semiconductor die. Additionally, a releasable layer is affixed to the semiconductor package, covering the first surface of the isolation structure, which can be released from the semiconductor package.

Career Highlights

Yee Beng Daryl Yeow is currently employed at Infineon Technologies Austria AG, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices.

Collaborations

He has collaborated with several talented individuals, including Li Fong Chong and Chii Shang Hong, who contribute to the innovative environment at Infineon Technologies.

Conclusion

Yee Beng Daryl Yeow's contributions to semiconductor technology through his patents and collaborations highlight his role as a significant inventor in the field. His work continues to influence advancements in semiconductor devices.