Penang, Malaysia

Yean Ling Soon

This inventor holds 1 USPTO granted patent and 5 published patent applications. Top assignee: Intel Corporation. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yean Ling Soon. Retrieved from https://idiyas.com/inventor/yean-ling-soon

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Yean Ling Soon: Innovator in Electronic Device Technology

Introduction

Yean Ling Soon is a notable inventor based in Penang, Malaysia. She has made significant contributions to the field of electronic devices, particularly in the area of interconnect technology. Her innovative work has led to the development of a patent that addresses critical challenges in high-speed electronic communications.

Latest Patents

Yean Ling Soon holds a patent for "Low loss high-speed interconnects." This invention discloses an electronic device and associated methods that enhance the performance of electronic assemblies. The device features asymmetrically situated conductors, which include a ground plane, a central shield portion, and side shield portions. This design aims to minimize signal loss and improve the efficiency of high-speed data transmission.

Career Highlights

Yean is currently employed at Intel Corporation, where she continues to push the boundaries of electronic device innovation. Her work at Intel has allowed her to collaborate with leading experts in the field and contribute to cutting-edge technology development.

Collaborations

Some of her notable coworkers include Bok Eng Cheah and Yang Liang Poh. Their collaborative efforts have further advanced the research and development of electronic devices, fostering an environment of innovation and creativity.

Conclusion

Yean Ling Soon's contributions to electronic device technology exemplify her commitment to innovation. Her patent for low loss high-speed interconnects showcases her ability to address complex challenges in the industry. Through her work at Intel Corporation, she continues to make a significant impact in the field of electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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