Singapore, Singapore

Yau Loong Chong

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Applied Materials, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yau Loong Chong. Retrieved from https://idiyas.com/inventor/yau-loong-chong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Yau Loong Chong: Innovator in Overlay Metrology

Introduction

Yau Loong Chong is a notable inventor based in Singapore, recognized for his contributions to the field of overlay metrology. With a focus on enhancing the accuracy of multi-stack die applications, Chong has made significant strides in the semiconductor industry.

Latest Patents

Chong holds a patent titled "Use of alternating layer patterns approach for effective overlay metrology in multi-stack die applications." This innovative method involves generating an image of a second die bonded on a first die, which is in turn bonded to a base substrate. The process includes determining the relative displacement between features on both dies and updating alignment instructions based on this analysis. He has 1 patent to his name.

Career Highlights

Yau Loong Chong is currently employed at Applied Materials, Inc., a leading company in the semiconductor equipment industry. His work focuses on developing advanced techniques that improve the precision of device manufacturing.

Collaborations

Chong collaborates with talented professionals such as Venkatakaushik Voleti and Ruiping Wang, contributing to innovative projects within his field.

Conclusion

Yau Loong Chong's work in overlay metrology exemplifies the importance of innovation in the semiconductor industry. His contributions continue to pave the way for advancements in technology and manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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