The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Oct. 11, 2023
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Yau Loong Chong, Singapore, SG;

Venkatakaushik Voleti, San Jose, CA (US);

Ruiping Wang, San Jose, CA (US);

Mehdi Vaez-Iravani, Los Gatos, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G01N 21/95 (2006.01); G06T 7/00 (2017.01);
U.S. Cl.
CPC ...
G03F 7/70633 (2013.01); G03F 7/705 (2013.01); G03F 7/70625 (2013.01); G06T 7/0004 (2013.01); G06T 2207/30148 (2013.01);
Abstract

Embodiments of the disclosure include a method for forming a device comprising generating an image of a second die that is bonded on a first die that is bonded on a base substrate, the first die having a first feature formed on a first surface of the first die and the second die having a second feature formed on a second surface of the second die, determining a relative displacement between portions of the first feature and the second feature based on the generated image, and determining updated alignment instructions based on the determined relative displacement.


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