Yasushi Masuda

Title: Innovator Yasushi Masuda: Pioneering Pressure Sensitive Adhesive Technology

Introduction: Yasushi Masuda, an inventor based in Nishiki-Machi, Japan, has made significant contributions in the field of adhesive technologies. With one patent to his name, Masuda is primarily recognized for his innovative approach to creating pressure sensitive adhesive sheets that are used for wafer sticking applications.

Latest Patents: Masuda holds a patent for a novel pressure sensitive adhesive sheet designed for wafer sticking. This invention features a base composed of polyvinyl chloride that contains a plasticizer. Above this base is an energy radiation curable pressure sensitive adhesive layer made of vinyl acetate copolymer. Notably, before the exposure to energy radiation, this adhesive layer has an elastic modulus ranging from 4.0×10 to 5.0×10 Pa at 50°C. The revolutionary aspect of this adhesive sheet is its ability to inhibit wafer vibration during the dicing process, thereby minimizing the potential for chipping.

Career Highlights: Throughout his career, Yasushi Masuda has focused on developing innovative solutions that enhance manufacturing processes, particularly in the semiconductor industry. His expertise in adhesive technology has made him an essential figure in improving the efficiency and effectiveness of wafer production practices.

Collaborations: Masuda has worked alongside notable colleagues in his field, including Hideki Numazawa and Osamu Yamazaki. Their joint efforts contribute to advancements in adhesive applications, demonstrating the importance of teamwork in driving innovation.

Conclusion: Yasushi Masuda stands out as a dedicated inventor whose work on pressure sensitive adhesive sheets is shaping the future of wafer sticking applications. His contributions not only highlight the innovative spirit within the adhesive technology sector but also underscore the collaborative nature of invention, as evidenced by his partnerships with esteemed coworkers.