The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2003

Filed:

Feb. 16, 2001
Applicant:
Inventors:

Yasushi Masuda, Nishiki-machi, JP;

Hideki Numazawa, Urawa, JP;

Osamu Yamazaki, Urawa, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 1/504 ; B32B 7/12 ; C09J 7/02 ;
U.S. Cl.
CPC ...
B32B 1/504 ; B32B 7/12 ; C09J 7/02 ;
Abstract

A pressure sensitive adhesive sheet for wafer sticking, comprising a base of polyvinyl chloride containing a plasticizer and, superimposed thereon, an energy radiation curable pressure sensitive adhesive layer of vinyl acetate copolymer, the energy radiation curable pressure sensitive adhesive layer, before exposure to energy radiation, having an elastic modulus ranging from 4.0×10 to 5.0×10 Pa at 50° C. The use of this pressure sensitive adhesive sheet for wafer sticking enables inhibiting the vibration of wafer at the time of dicing of the wafer so that chipping of the wafer can be minimized.


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