Yasunobu Horie

Title: Yasunobu Horie: Innovator in Moisture Curable Compositions

Introduction

Yasunobu Horie is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of adhesive and sealing materials through his innovative work. With a total of 2 patents, Horie has focused on developing moisture curable compositions that excel in various properties.

Latest Patents

Horie's latest patents include a moisture curable composition that is remarkable for its transparency, operating efficiency, and storage stability. This composition is particularly suitable for use as an adhesive and sealing material. The formulation involves blending 100 parts by weight of a mixture (A) with 2 to 300 parts by weight of an amorphous powder (B). The mixture (A) consists of a copolymer with reactive silicon groups that can be cross-linked by hydrolysis. This copolymer's molecular chain includes alkylacrylate and/or alkylmethacrylate monomeric units with varying carbon chain lengths. Additionally, it contains a polymer primarily made of oxyalkylene, which also features reactive silicon groups. The amorphous powder (B) has a grain diameter ranging from 0.01 µm to 300 µm.

Career Highlights

Horie is currently associated with Cemedine Co., Ltd., a company known for its expertise in adhesive technologies. His work has significantly advanced the capabilities of moisture curable compositions, making them more efficient and versatile for various applications.

Collaborations

Horie collaborates with fellow inventor Yoshinobu Egawa, contributing to the innovative environment at Cemedine Co., Ltd. Their combined efforts have led to the development of cutting-edge adhesive solutions.

Conclusion

Yasunobu Horie's contributions to the field of moisture curable compositions highlight his innovative spirit and dedication to advancing adhesive technologies. His work continues to influence the industry positively.