This inventor holds 1 USPTO granted patent. Top assignee: Resonac Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yasuhisa Ishida: Inventor of Advanced Resin Materials.
Introduction
Yasuhisa Ishida is an inventor based in Tokyo, Japan, whose patent work includes a resin composition designed for applications requiring substantial insulating filler content. He is associated with Resonac Corporation.
Latest Patents
Ishida is named on one patent, titled “Resin Composition, Film and Cured Product.” The invention describes a resin composition containing an insulating filler with a specific gravity of 6.0 or higher and a resin with a polar group. The specified filler makes up at least 50% by volume of the composition’s total solid content. The patent also concerns films and cured products made using the composition. Ishida’s reported portfolio includes 1 patent.
Career Highlights
Ishida’s documented patent contribution focuses on resin materials and their use in films and cured products. His work is associated with Resonac Corporation, a company active in materials and chemical technologies.
Collaborations
The patent information provided also names Takaya Yamamoto and Saori Mizunoe as Ishida’s coworkers. Their inclusion reflects a collaborative context for the disclosed materials innovation.
Conclusion
Yasuhisa Ishida’s patent work highlights a resin composition that combines a polar-group resin with a high proportion of dense insulating filler, connecting his inventive contribution with Resonac Corporation’s materials research.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile