Yasuhiro Sugiura

Title: Yasuhiro Sugiura: Innovator in Wiring Substrate Technology

Introduction

Yasuhiro Sugiura is a notable inventor based in Makinohara, Japan. He has made significant contributions to the field of wiring substrate technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and functionality of wiring substrates used in various electronic components.

Latest Patents

Sugiura's latest patents include innovative designs for wiring substrates. One of his patents discloses a wiring substrate that features a high thermal conductive layer. This substrate is designed with a mounting surface for various components on either the front or rear surface. Additionally, it includes a window section and a connection terminal that extends from the inside surface of the window, bending perpendicularly to the substrate's surface. Another patent describes a wiring substrate with a high heat radiation capability, which integrates a heat radiation piece section with the connection terminal.

Career Highlights

Yasuhiro Sugiura is currently employed at Yazaki Corporation, a company known for its advancements in automotive technology and wiring systems. His role at Yazaki has allowed him to apply his innovative ideas in practical applications, contributing to the company's reputation for quality and innovation in the industry.

Collaborations

Sugiura has collaborated with notable coworkers, including Akira Harao and Mototatsu Matsunaga. Their combined expertise has fostered a creative environment that encourages the development of cutting-edge technologies in wiring substrates.

Conclusion

Yasuhiro Sugiura's contributions to wiring substrate technology exemplify his commitment to innovation. His patents reflect a deep understanding of thermal management and component integration, making him a valuable asset in the field of electronics.